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Photonics

Joseph Demers / November 13, 2019

Bakman Leveraging Patented “Clip” Technology

Bakman Technologies announced today that the company has been contracted to develop photonic interconnects for a large manufacturer. While Bakman Technologies is known for manufacturing Terahertz components and instruments, they also maintain key technology that’s useful for hybrid photonic packaging. The patented optical “clip” technology enables sub-micron adjustability. Additionally, the clips are resistance spot welded, so […]

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