Bakman Technologies announced today that the company has been contracted to develop photonic interconnects for a large manufacturer.
While Bakman Technologies is known for manufacturing Terahertz components and instruments, they also maintain key technology that’s useful for hybrid photonic packaging. The patented optical “clip” technology enables sub-micron adjustability. Additionally, the clips are resistance spot welded, so they are robust and stable in extreme environments. They were developed for free-space interconnect needs between co-packaged optical components, and have been used in multiple applications including: compact mode-locked lasers, co-collimated dual laser packages, and fiber optic gyroscope transceivers.
“The clip technology allows sub-micron alignment of optical components with some simple tooling and without the need for an expensive laser welder. Securing the components in place is done with a simple resistance welder that can be bought online.” states Dr. Joseph R. Demers, the CEO of Bakman Technologies. “We have known for some time that this technology is valuable, and we are happy that we have the opportunity to utilize it in an application that is too demanding for epoxies. Furthermore, it allows us to diversify our product line and expand into a much larger market.”
Bakman Technologies acquired the Advanced Photonics division from Emcore Corporation in 2015. The acquisition included all the inventory, equipment, key personnel, and intellectual property related to the terahertz product line as well as the micro-lens mounting “clip” technology.